Third-generation semiconductor cleaning equipment (SiC, GaN) faces severe space constraints. Standard FFUs at 250–350mm simply cannot fit into the limited vertical clearance of these advanced tools. This article introduces DSX's 70mm Ultra-Thin EFU—engineered specifically for space-constrained equipment integration. With a total operational thickness of ~100mm, ULPA filtration efficiency up to 99.9995% (@0.12μm), and full-supply-chain manufacturing, this solution enables cleaning equipment manufacturers to maximize internal space without compromising cleanroom performance.
 

Learn how low noise FFUs enhance cleanroom productivity by reducing acoustic pollution. This technical guide explores Deshengxin's proprietary motor technology and advanced aerodynamic housing designs that achieve whisper-quiet operation (typically <58 dB) while maintaining stable airflow for Class 1-100,000 environments.