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At 3nm process nodes, a single 0.05μm dust particle can distort EUV lithography patterns, scrapping million-dollar wafers. With ISO 1 cleanrooms requiring ≤10 particles/m³ (≥0.1μm), DeshengxinFFU’s advanced filtration and airflow control technologies have become indispensable for leading foundries.
Lithography’s Ultra-Sensitive Demands
EUV/DUV lenses require near-zero 0.05μm particle tolerance
±0.1°C temperature shifts cause photoresist deformation
Humidity fluctuations (>±1%) induce nanoscale overlay errors
Legacy FFU Limitations
99.99% HEPA filters insufficient for sub-5nm processes
Turbulent zones from ±15% airflow variation
High maintenance costs and energy waste
H15+ ULPA Filters: 99.9995% efficiency on 0.12μm particles (industry-leading)
Anti-Static Nanocoating: Reduces particle adhesion, extends filter life by 40%
Real-Time Pressure Monitoring: Auto-adjusts fan speed for consistent cleanliness
CFD-Optimized Laminar Flow: Eliminates turbulence with ±5% velocity uniformity
Multi-Stage Variable Fans: 0.3-0.5m/s adjustable airflow for different tool zones
Proven Results: 0.03 defects/cm² achieved in 12-inch wafer lithography areas
Closed-Loop Sensors: Maintains ±0.05°C/±0.5%RH for photolithography stability
Energy-Smart Operation: 30% lower power consumption vs. conventional FFUs
Yield Impact: 98.4% photoresist coating success rate documented
✅ Full Lifecycle Support: Cleanroom design, FFU deployment, and predictive maintenance
✅ Localized Supply Chain: 100% domestic filters and motors bypass geopolitical risks
✅ ROI Guaranteed: $2.1M/year savings per 10k FFU units through yield gains and energy efficiency
Deshengxin FFU redefines cleanroom standards with data-driven contamination control. From mature 28nm yield optimization to cutting-edge GAA transistor production, its nanoscale protection enables fabs to maximize wafer value.
Act Now: Request a free cleanroom audit and discover how DeshengxinFFU can elevate your yield metrics.