70mm Ultra-Thin EFU: The Space-Saving Solution for Third-Generation Semiconductor Cleaning Equipment

The Growing Challenge in Third-Generation Semiconductor Manufacturing

Third-generation semiconductors—silicon carbide (SiC) and gallium nitride (GaN)—are transforming the power electronics and RF industries-. These wide-bandgap materials enable higher efficiency, higher temperature operation, and smaller form factors compared to traditional silicon.

But manufacturing SiC and GaN devices presents unique challenges. Cleaning processes are critical—removing particles, organics, metals, and oxides from wafer surfaces-. Wet cleaning equipment for these materials must handle aggressive chemistries, high temperatures, and precise process control.

And here's the problem: these cleaning tools are running out of space.

The Space Constraint: A Critical Bottleneck

Third-generation semiconductor cleaning equipment is becoming increasingly compact. Industry reports highlight that newer cleaning systems are achieving 60% or more space reduction compared to traditional equipment-. Some systems have achieved 67% improvement in cleanroom space utilization-.

This trend toward miniaturization is driven by the need to maximize cleanroom real estate—one of the most expensive resources in semiconductor manufacturing.

But there's a catch. As cleaning tools shrink, the internal vertical space available for air purification units also shrinks—often to just 100–150mm.

Standard FFUs? They're typically 250–350mm thick.

They simply don't fit.

Equipment engineers are forced into an impossible trade-off: increase the overall tool footprint (defeating the purpose of miniaturization) or compromise on internal laminar flow purification (risking wafer yield).

Neither option is acceptable. Especially in third-generation semiconductor manufacturing, where SiC and GaN wafers are expensive and defect-sensitive.

The Solution: DSX 70mm Ultra-Thin EFU

Wujiang Deshengxin Purification Equipment Co., Ltd. (DSX) —a full-supply-chain cleanroom equipment manufacturer with over 20 years of industry experience—has developed a purpose-built solution: the 70mm Ultra-Thin EFU (Equipment Fan Filter Unit) .

By shrinking the fan housing to just 70mm and achieving a total operational thickness of approximately 100mm (including the HEPA filter), this innovation directly addresses the space constraints of third-generation semiconductor cleaning equipment.

How 70mm is Achieved: The Full-Supply-Chain Advantage

Many manufacturers cannot achieve such extreme thinness because they rely on assembling off-the-shelf standard parts. They are essentially "assembly shops"—buying fans from one supplier, filters from another, and controllers from a third.

DSX operates differently. As a true full-supply-chain source factory, DSX designs, engineers, and manufactures core components entirely in-house:

1. Custom 70mm Brushless Micro-Fan

Instead of using standard off-the-shelf fans (typically too thick), DSX independently developed an EC brushless micro-fan specifically matched for ultra-thin structures. Even within the extremely flat 70mm housing, this custom motor delivers powerful static pressure and highly stable airflow.

2. High Dust-Capacity Mini-Pleat Filters

The self-manufactured premium shallow-pleat HEPA/ULPA filter module perfectly mates with the 70mm housing, ensuring incredibly low resistance and filtration efficiency up to 99.9995% (@0.12μm) —ULPA-grade performance.

3. Optimized Internal Geometry

Because DSX completely controls the core components, there's no need to accommodate bulky off-the-shelf parts. The internal geometry is perfectly optimized for compact equipment-end purification.

This vertical integration delivers three critical advantages for cleaning equipment manufacturers:

• Unmatched R&D agility for custom sizing—non-standard dimensions and unique control interfaces accommodated without waiting on multiple suppliers

• Total quality control for critical applications—from motor winding to filter media selection to final assembly, every step is under one roof

• Highly cost-effective innovation via direct-from-factory pricing—no middleman markups

Core Technical Specifications

Why Third-Generation Cleaning Equipment Needs This Solution

Third-generation semiconductor cleaning equipment presents unique demands that make the DSX 70mm Ultra-Thin EFU particularly valuable:

1. Space Efficiency Without Compromise

Cleaning tools for SiC and GaN wafers must handle aggressive chemistries (SC1, SC2, HF, KOH, H2SO4)-. This requires robust construction—but also leaves less room for purification systems The 70mm EFU slides like a "drawer" into internal cavities, ceilings, or side walls, establishing flawless unidirectional laminar flow without increasing the equipment's footprint.

2. Vibration Sensitivity

Cleaning equipment for SiC and GaN often incorporates optical inspection and precision handling systems. Micro-vibrations from fan motors can compromise these sensitive operations. DSX's ultra-thin units feature aerospace-grade dynamic balance calibration and anti-vibration design, making them ideal for vibration-sensitive semiconductor wafer processing

3. AMC (Airborne Molecular Contamination) Control

Advanced SiC and GaN processes are sensitive to airborne molecular contaminants. DSX offers optional PTFE (polytetrafluoroethylene) boron-free ultra-fine filter media for AMC-sensitive applications, with the ability to integrate specialized chemical filtration modules when required.

4. Smart Control Integration

Modern semiconductor fabs demand centralized control and real-time monitoring of all environmental systems. The DSX 70mm Ultra-Thin EFU supports RS485 Modbus protocol, enabling seamless integration with equipment PLC systems and facility management systems.

Application Scenarios: Cleaning Equipment Integration

The DSX 70mm Ultra-Thin EFU is ideal for:

• Single-wafer cleaning tools for SiC and GaN—compact chambers with tight clearances

• Batch wet cleaning stations—space-constrained chemical processing modules

• RCA cleaning equipment—where chemical compatibility and space efficiency are both critical-

• Post-etch residue removal tools—tight integration with etching process modules

• Wafer drying and spin-rinse systems—limited overhead space for laminar flow

• EFEM (Equipment Front End Modules) connected to cleaning tools—maintaining cleanliness during wafer transfer

The DSX Difference: A Partner, Not Just a Supplier

When you source from a full-supply-chain manufacturer like DSX, you get more than just a product:

• Consistent quality—every component manufactured to the same exacting standards, batch after batch

• Faster response—customization lead times shortened by 30%–50% because there's no waiting on external suppliers

• Native compatibility—fan, filter, and controller designed from the start to work together

• True customization—non-standard dimensions, special airflow requirements, unique control interfaces—all possible because DSX controls the entire production chain

• Scalable production—operating out of a 30,000-square-meter manufacturing facility with industrial strength for large-scale bulk orders

With over 20 years of experience and ISO9001/ISO14001/ISO45001 certification, DSX is committed to providing stable, efficient, and innovative purification solutions to the global semiconductor industry

Frequently Asked Questions

Q: Why can't I just use a standard FFU in my cleaning equipment?
Standard FFUs are typically 250–350mm thick—designed for cleanroom ceilings, not for tight equipment integration. They simply won't fit into the 80–150mm vertical clearances common in modern cleaning tools.

Q: Does the ultra-thin design compromise filtration performance?
No. The DSX 70mm Ultra-Thin EFU achieves ULPA-grade filtration efficiency up to 99.9995% (@0.12μm) through custom-engineered mini-pleat filters and optimized internal geometry. Thin doesn't mean weak—it means re-engineered.

Q: Can the EFU be customized for non-standard dimensions?
Yes. DSX supports full customization: non-standard sizes, special airflow requirements, unique control interfaces (potentiometer/0-10V/MODBUS/wireless monitoring), and filter types (chemical-resistant/high-temperature/anti-static)—all available on request.

Q: What about lead times for custom orders?
Because core components are manufactured in-house, DSX offers lead times 30%–50% shorter than assembly-shop competitors who must wait on multiple external suppliers.

Q: Does DSX serve cleaning equipment manufacturers globally?
Yes. Wujiang Deshengxin has been serving the global market for over 20 years and exports to semiconductor manufacturers worldwide.

Q: How do I get started with a custom EFU for my cleaning equipment?
Contact DSX's engineering team with your equipment's dimensional constraints, cleanliness requirements, and control interface specifications. The team will design and prototype the exact solution you need.

Conclusion: The Future of Cleaning Equipment Purification

Third-generation semiconductors—SiC and GaN—are driving the next wave of power electronics and RF innovation. The equipment that cleans these wafers must keep pace: more compact, more efficient, and more capable than ever before.

The days of "one-size-fits-all" FFUs in cleaning equipment are ending. The future belongs to purpose-engineered, ultra-compact EFUs designed specifically for equipment-end integration.

DSX's 70mm Ultra-Thin EFU represents a significant step forward. By combining full-supply-chain manufacturing, custom-engineered components, and an unwavering focus on space efficiency, it enables cleaning equipment manufacturers to:

• Maximize internal tool volume without compromising on cleanliness

• Simplify integration with drawer-like installation

• Maintain rigorous cleanliness standards even in the tightest spaces

With over 20 years of experience, full-supply-chain manufacturing, and a commitment to innovation, Wujiang Deshengxin Purification Equipment Co., Ltd. (DSX) is your trusted partner for semiconductor equipment purification solutions.